We have 480 Octavo SIPs (P/N: OSD3358-512M-BSM); original vacuum sealed; date code 1833 (for 180 units) and 1748 (for 300 units). An additional 77 unit packing has been opened in the past and re-sealed in May 2018 (date code: 1748).
The OSD335x-SM is the smallest Texas Instruments AM335x module. It integrates the TI Sitara™ ARM® Cortex®-A8 AM335x processor, DDR3 memory, TPS65217C PMIC, TL5209 LDO, all the needed passives, and 4KB of EEPROM into a single BGA package. At 21mm X 21mm, it is 60% smaller than the discrete components and 40% smaller than the OSD335x.
The OSD335x-SM utilizes the same wide 1.27mm (50mil) pitch as the rest of the OSD335x family. This combined with a new optimized Pin Map allows designers to escape all the BGA signals in a single layer. The wide pitch also simplifies the assemble process and removes common concerns associated with manufacturing BGAs.
The OSD335x-SM also gives designers the ability to tailor the device to meet their needs. The I/O Voltage Domains and the ADC Ranges are both programmable. The PMIC low power modes are also made accessible as well as the PMIC voltage monitors giving the ability to more finely tune the power performance of the final design.
The OSD335x-SM is the perfect solution for the designer that is looking for the most flexible ARM-based solution in the smallest footprint.